Thermal Data
Heat sources and heat extraction method
PCI Express products
Applies to:
The main heat contributors are:
- The electronic devices of the Coaxlink card including the losses of the power converters of the main power distribution network.
- The losses of the 24 V power converter of the auxiliary power distribution network. This contribution depends on the delivered PoCXP power.
Product | Main | Auxiliary | Total |
---|---|---|---|
|
|
0 ~ 1.3 | 9.3 ~ 10.6 |
|
|
0 ~ 2.7 | 11.4 ~ 14.1 |
|
|
0 ~ 5.5 | 12.1 ~ 17.6 |
|
|
0 ~ 5.5 | 16.8 ~ 22.3 |
|
|
0 ~ 5.5 | 16.8 ~ 22.3 |
The heat produced by the board is dissipated into the ambient air inside the Host PC. The heat exchange is facilitated by a heat sink and a fan mounted on the FPGA (the component having the largest heat source).
The thermal design must ensure sufficient air flow along both sides to keep the FPGA die temperature below the upper limit of the allowed temperature range. The application is responsible for regularly checking the temperature and for taking the appropriate action in case of excessive temperature.
PCIe/104 Products
Applies to:
The main heat contributors are the electronic devices of the main card. This includes the losses of the power converters of the main power distribution network.
Product | Main | Others | Total |
---|---|---|---|
|
|
- | 8.4 |
|
|
- | 8.4 |
The heat produced by the board is conducted to the chassis enclosure using a heatsink such as the
The thermal design of the PCIe/104 system must ensure an adequate cooling of the enclosure to keep the FPGA die temperature and the ambient air temperature below the upper limits of the allowed temperature range. The application is responsible for regularly checking the temperature and for taking the appropriate action in case of excessive temperature.