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Thermal Data

Heat sources and heat extraction method

PCI Express products

Applies to:

The main heat contributors are:

  • The electronic devices of the Coaxlink card including the losses of the power converters of the main power distribution network.
  • The losses of the 24 V power converter of the auxiliary power distribution network. This contribution depends on the delivered PoCXP power.
Estimated heat power [W]
Product Main Auxiliary Total
1630 Coaxlink Mono 9.3 0 ~ 1.3 9.3 ~ 10.6
1631 Coaxlink Duo 11.4 0 ~ 2.7 11.4 ~ 14.1
1632 Coaxlink Quad 12.1 0 ~ 5.5 12.1 ~ 17.6
1633 Coaxlink Quad G3 16.8 0 ~ 5.5 16.8 ~ 22.3
1635 Coaxlink Quad G3 DF 16.8 0 ~ 5.5 16.8 ~ 22.3
Note: The data of the auxiliary column are calculated with 17 W of PoCXP per connector and a worst case 24V DC/DC converter efficiency of 92.5%..

The heat produced by the board is dissipated into the ambient air inside the Host PC. The heat exchange is facilitated by a heat sink and a fan mounted on the FPGA (the component having the largest heat source).

The thermal design must ensure sufficient air flow along both sides to keep the FPGA die temperature below the upper limit of the allowed temperature range. The application is responsible for regularly checking the temperature and for taking the appropriate action in case of excessive temperature.

PCIe/104 Products

Applies to:

The main heat contributors are the electronic devices of the main card. This includes the losses of the power converters of the main power distribution network.

Estimated heat power [W]
Product Main Others Total
1629 Coaxlink Duo PCIe/104-EMB 8.4 - 8.4
1634 Coaxlink Duo PCIe/104-MIL 8.4 - 8.4

The heat produced by the board is conducted to the chassis enclosure using a heatsink such as the 3301 Thermal drain (Model 1) for Coaxlink Duo PCIe/104

The thermal design of the PCIe/104 system must ensure an adequate cooling of the enclosure to keep the FPGA die temperature and the ambient air temperature below the upper limits of the allowed temperature range. The application is responsible for regularly checking the temperature and for taking the appropriate action in case of excessive temperature.