Using Standard Heatsink

Picolo U4 H.264 PCI-104 is equipped with a Euresys standard heatsink. Here are the references of the heatsink:

Manufacturer

Model

Height

Thermal impedance at 200 LFM (~ 1 m/s)

Radian Heatsinks

HS2067DB

5.8 mm

4 K / W

The mounted heatsink is compliant with the PCI-104 specification and has limited height, but its thermal impedance meets the requirements.

The heatsink is fixed to the board with the following four spring-loaded brass push pins:

Manufacturer

Model

Height

Radian Heatsinks

HS8103SP008

14.9 mm

The thermal contacts between the heatsink and the U1, U3, and U4 components are implemented with the following thermal pads:

Manufacturer

Model

Thermal resistance

Location

Parker Chomerics

Therm-A-GAP, G579 1 mm thickness, circle, diameter 19 mm

1.6 K / W

U1

Parker Chomerics

Therm-A-GAP, G579, 1.78 mm thickness, rectangle 8x27mm

4 K / W

U3, U4

The heatsink extracts the heat efficiently from the electronic components, and transfers it to the ambient air circulating between adjacent modules.

It is mandatory to establish airflow along the fins of the heatsink to remove the heat from the inter-module gap. For safe operation up to maximum ambient air temperature of 85°C, it is necessary to have a linear air speed of at a min of 1 m/s (200 LFM).

This can be achieved by a fan installed in the chassis containing the PC/104 stack.