Using Custom Heatsinks
The following solutions are applicable to:
- Picolo U4 H.264 PCI-104 RH.
The following requirements have to be fulfill:
- Design a heatsink ensuring that:
- its footprint fits the mechanical requirements of the board
- Its thermal impedance is sufficiently low to fulfill all the requirements listed in Board Thermal Requirements
- Mount the heatsink on the board using
- Thermal pads on U1, U3, and U4
- The four fixation holes
The following two classes of custom heatsink can be considered:
- Metallic structures that establishes a low thermal impedance between the device-to-be-cooled and the ambient air. These structures are characterized by a very large surface at the metal-air interface. Such a custom heatsink can be manufactured by customization of standardized aluminum extruded profiles using drilling and/or grinding machines.
- Metallic structures that establishes a low thermal impedance between the device-to-be-cooled and the ambient air. These structure are characterized by a large cross-section and the use of highly conductive metal such as copper or aluminum. Such a custom heatsink can be manufactured by a customization of straight metal bars using drilling and/or grinding machine.